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Creep Resistant Cu-based CuCrNbZr Alloy with High Thermal Conductivity

A novel Cu-based alloy with high thermal conductivity and thermal creep resistance for high-temperature applicationsRSS.HDBackground> Background: <High strength, high conductivity copper (Cu) alloys are a potentially attractive option for a variety of demanding high heat flux structural applications ranging from aerospace to fusion energy. Fusion...

Published: 4/26/2024 | Inventor(s): Lance Snead, Lizhen Tan, Ling Wang, Steven Zinkle

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Category(s): Technology Classifications, Technology Classifications > Material and Composites, Campus > Stony Brook University